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A new method to keep computers cool has been developed at UW-Madison.

Air cooling technology no longer can keep pace with the heat generated by today's powerful supercomputers, said UW mechanical engineering Professor Tim Shedd, who developed a new liquid cooling method with graduate student Adam Pautsch.

In general, the faster the computer the more heat generated, although design advances can mitigate the correlation, Shedd said.

"Many computer chips actually are set by thermal limit, not electrical limit," he said.

Early tests have shown that the new method can remove heat up to three times faster than other spray techniques.

Rather than wetting computer chips with a cone-shaped shower of coolant as do existing devices, the new system drenches chips with high velocity lines of liquid, much like sheets of wind-driven rain.

"As far as the density of heat goes, this technology can remove up to four times what the space shuttle experiences upon re-entry," Shedd said.

The project began at the request of Cray Inc., the Chippewa Falls-based manufacturer of supercomputers, and was funded through the UW-Madison Graduate School Industrial and Economic Development Research (I&EDR) program.